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A simulation study of new multi-objective composite dispatching rules, CONWIP, and push lot release in semiconductor fabrication
Abstract
This paper evaluates dispatching rules and order release policies in two wafer fabrication facilities (thereafter referred to as ‘fab’) representing ASIC (application specific integrated circuit) and low-mix high-volume production. Order release policies were fixed-interval (push) release, and constant work-in-process (CONWIP) (pull) policy. Following rigorous fab modelling and statistical analysis, new composite dispatching rules were found to be robust for average and variance of flow time, as well as due-date adherence measures, in both production modes.
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- Citation information:
- Available online: 12 Jun 2008
Author affiliations
- a Daifuku America Corporation, 7408 W. Detroit Street, Chandler, AZ 85226, USA
- b Department of Industrial and Systems Engineering, Rochester Institute of Technology, Rochester, NY 14623, USA
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